F89ESSM23-W1 Wi-Fi Module
2.4g Wi-Fi
SDIO/GSPI
L14.00*W12.50*T2.00mm
Introduction
F89ESSM23-W1-VIA is a highly integrated and excellent performance Wireless LAN (WLA) SDIO network interface device. High-speed wireless connection up to 150 Mbps
Features
This specification is based on additional references listed as below.
iEEE 802.11b
iEEE 802.11g
iEEE 802.11n
Host Interface
Supports SDIO/GSPI.
Applications
OTT/IPTV/DVB/Set-top Box, Tablet PC, Advertising Machine,Intelligent TV, IPC/NVR, Industrial Control Equipment,Car Recorder,Intelligent Doorbell, Intelligent Projector, Virtual Reality, VR/AR, Wireless Storage, Printer, POS Machine, Electronic Scale,Vehicle Front/Rear End, Drone, Robot, HDMI Transmitter,Smart Gateway, Education,Toys, Lighting Lamps, Intelligent Street Light, Intelligent Home Appliances/Home Appliances Instrumentation (Water, Electricity, Gas), Smart City and other Consumer Electronic Products.
Block Diagram
Parameters
|
Model No. |
F89ESSM23-W1 |
Main Chipset |
RTL8723BS |
|
Interface |
SDIO/GSPI |
Wi-Fi Standard |
IEEE802.11b/g/n |
|
Data Rate |
iEEE 802.11b:11,5.5,2,1 Mbps iEEE 802.11g:54,48,36,24,18,12,9,6 Mbps iEEE 802.11n: up to 150 Mbps |
Certification |
RoHS,REACH |
|
RF Antenna |
External Antenna |
OS Supported |
Android/Linux/Win CE /iOS/XP/WIN7 |
|
Operating Frequency |
2.400～2.4835GHz |
Operating Voltage |
3.3V |
|
Dimension |
L14.00*W12.50*T2.00mm |
RF Chain |
1T1R |
|
Operating Temperature |
0°C to 55°C |
Storage Temperature |
-40°C to 80°C |
Ordering Information
|
Part No. |
Description |
|
F89ESSM23-W1 |
RTL8189ES,802.11b/g/n,1T1R,SDIO/GSPI,Android/Linux/Win CE /iOS/XP/WIN7,L14.00*W12.50*T2.00mm |
